ÚTEFČVUT Ústav technické a experimentální fyziky ČVUT v PrazeInstitute of Experimental and Applied Physics, CTU in Prague

Characterization of thin p-on-p radiation detectors with active edges

NázevTitle
Characterization of thin p-on-p radiation detectors with active edgesCharacterization of thin p-on-p radiation detectors with active edges
Druh výsledkuResult type
Článek v časopiseJournal article
AutořiAuthors
T. Peltola, X. Wu, J. Kalliopuska, C. Granja, J. Jakůbek, M. Jakůbek, J. Harkonen, A. Gadda
Klíčová slovaKeywords
Silicon radiation detectors, Pixel sensors, Electrical characterization, Charge collection, TCAD simulations
DOIDOI
10.1016/j.nima.2016.01.016
Časopis / citaceJournal / citation
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 813, 139-146 (2016) · ISSN 0168-9002
RokYear
2016
JazykLanguage
eng
ZáznamyRecords
ProjektProject
Urychlovač Van de Graaff - laditelný zdroj monoenergetických neutronů a rychlých iontůVan de Graaff accelerator - tunable source of monoenergetic neutrons and fast ions; Van de Graaff - urychlovač iontů HV2500 jako laditelný zdroj neutronů v rámci české a evropské velké infrastrukturyAccelerator of ions HV2500 as tuneable neutron source in frame of Czech and European Large Infrastructure
CitovánoCited by
3 (INSPIRE-HEP)
2017: 12018: 02019: 02020: 12021: 02022: 1
Plný text (open access)Full text (open access)
https://www.sciencedirect.com/science/article/pii/S016890021600019X
Citace ke staženíDownload citation
TXT · BibTeX

AbstraktAbstract

Active edge p-on-p silicon pixel detectors with thickness of 100 mu m were fabricated on 150 mm float zone silicon wafers at VTT. By combining measured results and TCAD simulations, a detailed study of electric field distributions and charge collection performances as a function of applied voltage in a p-on-p detector was carried out. A comparison with the results of a more conventional active edge p-on-n pixel sensor is presented. The results from 3D spatial mapping show that at pixel-to-edge distances less than 100 mu m the sensitive volume is extended to the physical edge of the detector when the applied voltage is above full depletion. The results from a spectroscopic measurement demonstrate a good functionality of the edge pixels. The interpixel isolation above full depletion and the breakdown voltage were found to be equal to the p-on-n sensor while lower charge collection was observed in the p-on-p pixel sensor below 80 V. Simulations indicated this to be partly a result of a more favourable weighting field in the p-on-n sensor and partly of lower hole lifetimes in the p-bulk.

Active edge p-on-p silicon pixel detectors with thickness of 100 mu m were fabricated on 150 mm float zone silicon wafers at VTT. By combining measured results and TCAD simulations, a detailed study of electric field distributions and charge collection performances as a function of applied voltage in a p-on-p detector was carried out. A comparison with the results of a more conventional active edge p-on-n pixel sensor is presented. The results from 3D spatial mapping show that at pixel-to-edge distances less than 100 mu m the sensitive volume is extended to the physical edge of the detector when the applied voltage is above full depletion. The results from a spectroscopic measurement demonstrate a good functionality of the edge pixels. The interpixel isolation above full depletion and the breakdown voltage were found to be equal to the p-on-n sensor while lower charge collection was observed in the p-on-p pixel sensor below 80 V. Simulations indicated this to be partly a result of a more favourable weighting field in the p-on-n sensor and partly of lower hole lifetimes in the p-bulk.

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