Ústav technické a experimentální fyziky Institute of Experimental and Applied Physics

CONSTRUCTION AND CHARACTERIZATION OF A 117-CM(2) SILICON PIXEL DETECTOR

NázevTitle
CONSTRUCTION AND CHARACTERIZATION OF A 117-CM(2) SILICON PIXEL DETECTORCONSTRUCTION AND CHARACTERIZATION OF A 117-CM(2) SILICON PIXEL DETECTOR
Druh výsledkuResult type
Článek v časopiseJournal article
AutořiAuthors
EHM. Heijne, F. Antinori, F. Barberis, S. Pospíšil
Časopis / citaceJournal / citation
IEEE Transactions on Nuclear Science. 1995, 1995(42), 413-418. ISSN 0018-9499.
RokYear
1995
JazykLanguage
eng
WoSWoS
A1995RP81900041
RIVRIV
ProjektProject
Fundamentální experimenty ve fyzice mikrosvětaFundamental Experiments in Physics of Microworld

AbstraktAbstract

t: A silicon pixel detector, developed in RD19, and consisting of 4 planes, similar to 30 cm(2) each, is operating for the first time in the lead ion experiment WA97 at CERN. The 288 CMOS readout chips are bump-bonded to 48 Si detector matrices, assembled in 8 identical arrays. The total number of pixel cells is nearly 300 000 and each cell, 75 mu m x 500 mu m, contains a complete signal processing chain. Overall dead area is less than 3%.

t: A silicon pixel detector, developed in RD19, and consisting of 4 planes, similar to 30 cm(2) each, is operating for the first time in the lead ion experiment WA97 at CERN. The 288 CMOS readout chips are bump-bonded to 48 Si detector matrices, assembled in 8 identical arrays. The total number of pixel cells is nearly 300 000 and each cell, 75 mu m x 500 mu m, contains a complete signal processing chain. Overall dead area is less than 3%.