Test beam results of 3D silicon pixel sensors for the ATLAS upgrade
- NázevTitle
- Test beam results of 3D silicon pixel sensors for the ATLAS upgradeTest beam results of 3D silicon pixel sensors for the ATLAS upgrade
- Druh výsledkuResult type
- Článek v časopiseJournal article
- AutořiAuthors
- P. G. Grenier, T. Slavíček, S. Pospíšil
- Klíčová slovaKeywords
- ATLAS upgrade, Silicon sensors, 3D sensors, radiation-hard detectors
- ExperimentCollaboration
- ATLAS 3D
- DOIDOI
- 10.1016/j.nima.2011.01.181
- Časopis / citaceJournal / citation
- Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 638(1), 33-40 (2011) · ISSN 0168-9002
- RokYear
- 2011
- JazykLanguage
- eng
- ZáznamyRecords
- ProjektProject
- Mezinárodní experiment ATLAS-CERNInternational Experiment ATLAS-CERN; Spolupráce ČR s CERNCollaboration of the Czech Republic with CERN; Konstrukce 3D detektoru ionizujícího záření - voxelový detektorDesign of 3D detector of ionizing radiation - voxel detector
- CitovánoCited by
- 36 (INSPIRE-HEP)
- Plný text (open access)Full text (open access)
- https://arxiv.org/pdf/1101.4203
- Citace ke staženíDownload citation
- TXT · BibTeX
AbstraktAbstract
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.