Dynamic defectoscopy with flat panel and CdTe Timepix X-ray detectors combined with an optical camera
- NázevTitle
- Dynamic defectoscopy with flat panel and CdTe Timepix X-ray detectors combined with an optical cameraDynamic defectoscopy with flat panel and CdTe Timepix X-ray detectors combined with an optical camera
- Druh výsledkuResult type
- Článek v časopiseJournal article
- AutořiAuthors
- D. Vavřík, A. Fauler, M. Fiederle, I. Jandejsek, M. Jakůbek, D. Tureček, A. Zwerger
- DOIDOI
- 10.1088/1748-0221/8/04/C04009
- Časopis / citaceJournal / citation
- Journal of Instrumentation. 2013, 8(8), ISSN 1748-0221.
- RokYear
- 2013
- JazykLanguage
- eng
- WoSWoS
- 000320998200002
- ScopusScopus
- 2-s2.0-84878289339
- RIVRIV
- RIV/68407700:21670/13:00217046!RIV14-GA0-21670___
- ProjektProject
- Vyhodnocování energie odpovědné za růst trhlinyEvaluation of the energy responsible for fracture advancing
AbstraktAbstract
Damage of gradually loaded ductile materials involves a number of physical processes which are highly nonlinear and have different intensity and extent. Dynamic defectoscopy (i.e. defectoscopy of time changing damage processes) combining an X-ray/optical imaging system is proposed for online visualization and analysis of the complex behaviour of such materials. A large area flat panel detector with rather long read out time is used for overall observation of slow damage processes. On the other hand, a semiconductor CdTe Timepix detector with small active area allows following the rapid damage processes occurring in the final phase of specimen failure. Optical imaging of the specimen surface was utilized for analysing the specimen deformations.
Damage of gradually loaded ductile materials involves a number of physical processes which are highly nonlinear and have different intensity and extent. Dynamic defectoscopy (i.e. defectoscopy of time changing damage processes) combining an X-ray/optical imaging system is proposed for online visualization and analysis of the complex behaviour of such materials. A large area flat panel detector with rather long read out time is used for overall observation of slow damage processes. On the other hand, a semiconductor CdTe Timepix detector with small active area allows following the rapid damage processes occurring in the final phase of specimen failure. Optical imaging of the specimen surface was utilized for analysing the specimen deformations.