ÚTEFČVUT Ústav technické a experimentální fyziky ČVUT v PrazeInstitute of Experimental and Applied Physics, CTU in Prague

The Medipix3RX: a high resolution, zero dead-time pixel detector readout chip allowing spectroscopic imaging

NázevTitle
The Medipix3RX: a high resolution, zero dead-time pixel detector readout chip allowing spectroscopic imagingThe Medipix3RX: a high resolution, zero dead-time pixel detector readout chip allowing spectroscopic imaging
Druh výsledkuResult type
Článek v časopiseJournal article
AutořiAuthors
R. Ballabriga, J. Alozy, G. Blaj, M. Campbell, M. Fiederle, E. Frojdh, H. Heijne, X. Llopart, M. Pichotka, S. Procz, L. Tlustos, W. Wong
Klíčová slovaKeywords
pixel detector, Medipix, spectroscopic imaging, readout chip, sensor degradation
KonferenceConference
14th International Workshop on Radiation Imaging Detectors (Figueira da Foz, Portugal, 2012-07-01)
DOIDOI
10.1088/1748-0221/8/02/C02016
Časopis / citaceJournal / citation
Journal of Instrumentation 8(02), C02016-C02016 (2013) · ISSN 1748-0221
RokYear
2013
JazykLanguage
eng
ZáznamyRecords
ProjektProject
Institucionální podpora na rozvoj výzkumné org.Institucionální podpora na rozvoj výzkumné org.
CitovánoCited by
53 (INSPIRE-HEP)
2013: 32014: 62015: 52016: 52017: 82018: 52019: 22020: 32021: 42022: 22023: 42024: 12025: 42026: 1
Plný text (open access)Full text (open access)
https://iopscience.iop.org/article/10.1088/1748-0221/8/02/C02016/pdf
Citace ke staženíDownload citation
TXT · BibTeX

AbstraktAbstract

The Medipix3 chips have been designed to permit spectroscopic imaging in highly segmented hybrid pixel detectors. Spectral degradation due to charge sharing in the sensor has been addressed by means of an architecture in which adjacent pixels communicate in the analog and digital domains on an event-by-event basis to reconstruct the deposited charge in a neighbourhood prior to the assignation of the hit to a single pixel. The Medipix3RX chip architecture is presented. The first results for the characterization of the chip with 300 μm thick Si sensors are given. Similar to 72e- r.m.s. noise and similar to 40e- r.m.s. of threshold dispersion after chip equalization have been measured in Single Pixel Mode of operation. The homogeneity of the image in Charge Summing mode is comparable to the Single Pixel Mode image. This demonstrates both modes are suitable for X-ray imaging applications.

The Medipix3 chips have been designed to permit spectroscopic imaging in highly segmented hybrid pixel detectors. Spectral degradation due to charge sharing in the sensor has been addressed by means of an architecture in which adjacent pixels communicate in the analog and digital domains on an event-by-event basis to reconstruct the deposited charge in a neighbourhood prior to the assignation of the hit to a single pixel. The Medipix3RX chip architecture is presented. The first results for the characterization of the chip with 300 μm thick Si sensors are given. Similar to 72e- r.m.s. noise and similar to 40e- r.m.s. of threshold dispersion after chip equalization have been measured in Single Pixel Mode of operation. The homogeneity of the image in Charge Summing mode is comparable to the Single Pixel Mode image. This demonstrates both modes are suitable for X-ray imaging applications.

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