Ústav technické a experimentální fyziky Institute of Experimental and Applied Physics

Large Area Pixel Detector WIDEPIX with Full Area Sensitivity Composed of 100 Timepix Assemblies with Edgeless Sensors

NázevTitle
Large Area Pixel Detector WIDEPIX with Full Area Sensitivity Composed of 100 Timepix Assemblies with Edgeless SensorsLarge Area Pixel Detector WIDEPIX with Full Area Sensitivity Composed of 100 Timepix Assemblies with Edgeless Sensors
Druh výsledkuResult type
Článek v časopiseJournal article
AutořiAuthors
J. Jakůbek, M. Jakůbek, M. Platkevič, P. Soukup, V. Sýkora, D. Tureček, D. Vavřík
DOIDOI
10.1088/1748-0221/9/04/C04018
Časopis / citaceJournal / citation
Journal of Instrumentation. 2014, 2014(9), ISSN 1748-0221.
RokYear
2014
JazykLanguage
eng
WoSWoS
000336123800018
ScopusScopus
2-s2.0-84899532594
RIVRIV
RIV/68407700:21670/14:00229007!RIV15-TA0-21670___
ProjektProject
Pracoviště pro nedestruktivní testování, diagnostiku a 3D zobrazování pomocí neutronové radiografie a tomografie (2011-2015, TA0/TA)Facility for nondestructive testing, diagnostics and 3D imaging based on neutron radiography and tomography.

AbstraktAbstract

The superior properties of the single particle counting semiconductor pixel detectors in radiation imaging are well known. They are namely: very high dynamic range due to digital counting, absence of integration and read-out noise, high spatial resolution and energy sensitivity. The major disadvantage of current pixel devices preventing their broad exploitation has been their relatively small sensitive area of few cm2. This disadvantage is often solved using tiling method placing many detector units side by side forming a large matrix. The current tiling techniques require rather large gaps of few millimeters between tiles. These gaps stand as areas insensitive to radiation which is acceptable only in some applications such as diffraction imaging. However standard transmission radiography requires fully continuous area sensitivity. In this article we present the new large area device WIDEPIX composed of a matrix of 10 x 10 tiles of silicon pixel detectors Timepix (each of 256 x 256 pixels with pitch of 55 µm) having fully sensitive area of 14.3 x 14.3 cm2 without any gaps between the tiles. The device contains a total of 6.5 mega pixels. This achievement was reached thanks to new technology of edgeless semiconductor sensors together with precise alignment technique and multilevel architecture of readout electronics. The mechanical construction of the device is fully modular and scalable. This concept allows replacing any single detector tile which significantly improves production yield. The first results in the field of X-ray radiography and material sensitive X-ray radiography are presented in this article.

The superior properties of the single particle counting semiconductor pixel detectors in radiation imaging are well known. They are namely: very high dynamic range due to digital counting, absence of integration and read-out noise, high spatial resolution and energy sensitivity. The major disadvantage of current pixel devices preventing their broad exploitation has been their relatively small sensitive area of few cm2. This disadvantage is often solved using tiling method placing many detector units side by side forming a large matrix. The current tiling techniques require rather large gaps of few millimeters between tiles. These gaps stand as areas insensitive to radiation which is acceptable only in some applications such as diffraction imaging. However standard transmission radiography requires fully continuous area sensitivity. In this article we present the new large area device WIDEPIX composed of a matrix of 10 x 10 tiles of silicon pixel detectors Timepix (each of 256 x 256 pixels with pitch of 55 µm) having fully sensitive area of 14.3 x 14.3 cm2 without any gaps between the tiles. The device contains a total of 6.5 mega pixels. This achievement was reached thanks to new technology of edgeless semiconductor sensors together with precise alignment technique and multilevel architecture of readout electronics. The mechanical construction of the device is fully modular and scalable. This concept allows replacing any single detector tile which significantly improves production yield. The first results in the field of X-ray radiography and material sensitive X-ray radiography are presented in this article.