Towards a new generation of pixel detector readout chips
- NázevTitle
- Towards a new generation of pixel detector readout chipsTowards a new generation of pixel detector readout chips
- Druh výsledkuResult type
- Článek v časopiseJournal article
- AutořiAuthors
- M. Campbell, J. Alozy, R. Ballabriga, E. Frojdh, E. Heijne, X. Llopart, T. Poikela, L. Tlustos, P. Valerio, W. Wong
- DOIDOI
- 10.1088/1748-0221/11/01/C01007
- Časopis / citaceJournal / citation
- Journal of Instrumentation. 2016, 11(1), ISSN 1748-0221.
- RokYear
- 2016
- JazykLanguage
- eng
- WoSWoS
- 000371469800007
- ScopusScopus
- 2-s2.0-84956952310
- RIVRIV
- RIV/68407700:21670/16:00310736!RIV17-MSM-21670___
- ProjektProject
- Institucionální podpora na rozvoj výzkumné org.Institucionální podpora na rozvoj výzkumné org.
AbstraktAbstract
The Medipix3 Collaboration has broken new ground in spectroscopic X-ray imaging and in single particle detection and tracking. This paper will review briefly the performance and limitations of the present generation of pixel detector readout chips developed by the Collaboration. Through Silicon Via technology has the potential to provide a significant improvement in the tile-ability and more flexibility in the choice of readout architecture. This has been explored in the context of 3 projects with CEA-LETI using Medipix3 and Timepix3 wafers. The next generation of chips will aim to provide improved spectroscopic imaging performance at rates compatible with human CT. It will also aim to provide full spectroscopic images with unprecedented energy and spatial resolution. Some of the opportunities and challenges posed by moving to a more dense CMOS process will be discussed.
The Medipix3 Collaboration has broken new ground in spectroscopic X-ray imaging and in single particle detection and tracking. This paper will review briefly the performance and limitations of the present generation of pixel detector readout chips developed by the Collaboration. Through Silicon Via technology has the potential to provide a significant improvement in the tile-ability and more flexibility in the choice of readout architecture. This has been explored in the context of 3 projects with CEA-LETI using Medipix3 and Timepix3 wafers. The next generation of chips will aim to provide improved spectroscopic imaging performance at rates compatible with human CT. It will also aim to provide full spectroscopic images with unprecedented energy and spatial resolution. Some of the opportunities and challenges posed by moving to a more dense CMOS process will be discussed.