High-rate, high-resolution single photon X-ray imaging: Medipix4, a large 4-side buttable pixel readout chip with high granularity and spectroscopic capabilities
- NázevTitle
- High-rate, high-resolution single photon X-ray imaging: Medipix4, a large 4-side buttable pixel readout chip with high granularity and spectroscopic capabilitiesHigh-rate, high-resolution single photon X-ray imaging: Medipix4, a large 4-side buttable pixel readout chip with high granularity and spectroscopic capabilities
- Druh výsledkuResult type
- Článek v časopiseJournal article
- AutořiAuthors
- V. Sriskaran, J. Alozy, R. Ballabriga, M. Campbell, P. Christodoulou, E. Heijne, L. Tlustos
- DOIDOI
- 10.1088/1748-0221/19/02/P02024
- Časopis / citaceJournal / citation
- Journal of Instrumentation. 2024, 19(2), ISSN 1748-0221.
- RokYear
- 2024
- JazykLanguage
- eng
- WoSWoS
- 001181748300008
- ScopusScopus
- 2-s2.0-85185399684
- RIVRIV
- RIV/68407700:21460/24:00374532!RIV25-MSM-21460___
- ProjektProject
- Inženýrské aplikace fyziky mikrosvětaEngineering applications of microworld physics; Institucionální podpora na rozvoj výzkumné org.Institucionální podpora na rozvoj výzkumné org.
AbstraktAbstract
The Medipix4 chip is the latest member in the Medipix/Timepix family of hybrid pixel detector chips aimed at high-rate spectroscopic X-ray imaging using high-Z materials. It can be tiled on all 4 sides making it ideal for constructing large-area detectors with minimal dead area. The chip is designed to read out a sensor of 320 × 320 pixels with dimensions of 75 μm× 75 μm or 160 × 160 pixels with dimensions of 150 μm× 150 μm. The readout architecture features energy binning of the single photons, which includes charge sharing correction for hits with energy spread over adjacent pixels. This paper presents the specifications, architecture, and circuit implementation of the chip, along with the first electrical measurements.
The Medipix4 chip is the latest member in the Medipix/Timepix family of hybrid pixel detector chips aimed at high-rate spectroscopic X-ray imaging using high-Z materials. It can be tiled on all 4 sides making it ideal for constructing large-area detectors with minimal dead area. The chip is designed to read out a sensor of 320 × 320 pixels with dimensions of 75 μm× 75 μm or 160 × 160 pixels with dimensions of 150 μm× 150 μm. The readout architecture features energy binning of the single photons, which includes charge sharing correction for hits with energy spread over adjacent pixels. This paper presents the specifications, architecture, and circuit implementation of the chip, along with the first electrical measurements.