Simultaneous X-ray and optical inspection of the crack advancing
- NázevTitle
- Simultaneous X-ray and optical inspection of the crack advancingSimultaneous X-ray and optical inspection of the crack advancing
- Druh výsledkuResult type
- Příspěvek ve sborníkuProceedings paper
- AutořiAuthors
- D. Vavřík, I. Jandejsek
- Časopis / citaceJournal / citation
- In: 18<sup>th</sup> European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale. Berlin: Deutscher Verband für Materialforschung und -prüfung e.V., 2010, pp. 145-151. ISBN 978-3-00-031802-3. Available from: http://www.gruppofrattura.it/ocs/index.php/esis/ECF18/paper/viewFile/6321/2189
- JazykLanguage
- eng
- ScopusScopus
- 2-s2.0-84870964300
- RIVRIV
- RIV/68407700:21670/10:00226899!RIV15-MSM-21670___
- ProjektProject
- Příprava, modifikace a charakterizace materiálů energetickým zářenímPreparation, Modification and Characterization of Materials by Energetic Radiation; Využití radionuklidů a ionizujícího zářeníApplication of radionuclides and ionising radiation; Spolupráce ČR s CERNCollaboration of the Czech Republic with CERN; Vyhodnocování energie odpovědné za růst trhlinyEvaluation of the energy responsible for fracture advancing
AbstraktAbstract
A fracture toughness test measures the resistance of a material to crack extension. Such a test may yield either a single value of fracture toughness or a resistance curve. Measurement of the resistance curve requires knowledge about crack initiation and its growing during loading. Concurrently knowledge about shape and scale of the damage zone is advantageous. X-ray Dynamic Defectoscopy was developed for these purposes. This method is suitable for detailed measurement of the crack growth, opening and branching. Simultaneously employed optical Digital Image Correlation method served for full field measurement of the displacement in the relatively large area surrounding crack tip.
A fracture toughness test measures the resistance of a material to crack extension. Such a test may yield either a single value of fracture toughness or a resistance curve. Measurement of the resistance curve requires knowledge about crack initiation and its growing during loading. Concurrently knowledge about shape and scale of the damage zone is advantageous. X-ray Dynamic Defectoscopy was developed for these purposes. This method is suitable for detailed measurement of the crack growth, opening and branching. Simultaneously employed optical Digital Image Correlation method served for full field measurement of the displacement in the relatively large area surrounding crack tip.